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 Freescale Semiconductor
Order this document by MCM63D736/D
128K x 36 Bit Synchronous Dual I/O, Dual Address SRAM
The MCM63D736 is a 4M-bit static random access memory, organized as 128K words of 36 bits. It features common data input and data output buffers and incorporates input and output registers on-board with high speed SRAM. The MCM63D736 allows the user to concurrently perform reads, writes, or pass-through cycles in combination on the two data ports. The two address ports (AX, AY) determine the read or write locations for their respective data ports (DQX, DQY). The synchronous design allows for precise cycle control with the use of an external single clock (K). All signal pins except output enables (GX, GY) are registered on the rising edge of clock (K). The pass-through feature allows data to be passed from one port to the other, in either direction. The PTX input must be asserted to pass data from port X to port Y. The PTY will likewise pass data from port Y to port X. A pass-through operation takes precedence over a read operation. For the case when AX and AY are the same, certain protocols are followed. If both ports are read, the reads occur normally. If one port is written and the other is read, the read from the array will occur before the data is written. If both ports are written, only the data on DQY will be written to the array. * * * * * * * * * * * * Single 3.3 V 5% Power Supply 133 MHz Maximum Clock Frequency Throughput of 4.8 Gigabits/Second Single Clock Operation Self-Timed Write Two Bi-Directional Data Buses Can be Configured as Separate I/O Pass-Through Feature Asynchronous Output Enables (GX, GY) LVTTL Compatible I/O Concurrent Reads and Writes 176-Pin TQFP Package -- Ethernet Switches -- SNA Switches -- Routers -- Shared Memory
MCM63D736
TQ PACKAGE 176 LEAD TQFP CASE 1101-01
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Suggested Applications -- ATM -- Cell/Frame Buffers
-- Cellular Base Stations -- RAID Systems
(c) Freescale Semiconductor, Inc., 2004. All rights reserved.
REV 4 7/6/00
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MCM63D736 1
Freescale Semiconductor, Inc.
BLOCK DIAGRAM
AX
17
ADDRESS REGISTER
128K x 36 ARRAY
ADDRESS REGISTER
17
AY
WX
WRITE X REGISTER
WRITE DRIVER
SENSE AMPS
SENSE AMPS
WRITE DRIVER
WRITE Y REGISTER
WY
PTX
PTX REGISTER
PASS-THROUGH
PTY REGISTER
PTY
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K ENABLE X REG 1 ENABLE X REG 2 GX
DATA IN REGISTER
OUTPUT REGISTER
OUTPUT REGISTER
DATA IN REGISTER ENABLE Y REG 1 ENABLE Y REG 2 GY E1Y E2Y
E1X E2X
DQX
DQY
MCM63D736 2
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PIN ASSIGNMENT
VSS DQY19 DQX19 VSS VDD DQY18 DQX18 AX6 AY6 AX7 AY7 VSS NC NC NC VSS NC NC E2Y E1Y K VDD VSS GY GX E2X E1X WY WX PTY PTX AX8 AY8 AX9 AY9 VSS VSS DQX17 DQY17 VDD VSS DQX16 DQY16 VSS
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VSS DQX20 DQY20 VDD VSS DQX21 DQY21 DQX22 DQY22 VDD VSS DQX23 DQY23 DQX24 DQY24 VDD VSS DQX25 DQY25 DQX26 DQY26 VDD VSS DQY27 DQX27 DQY28 DQX28 VDD VSS DQY29 DQX29 DQY30 DQX30 VDD VSS DQY31 DQX31 DQY32 DQX32 VDD VSS DQY33 DQX33 VSS
132 1 2 131 130 3 129 4 128 5 127 6 126 7 125 8 124 9 123 10 122 11 121 12 120 13 119 14 118 15 16 117 116 17 115 18 114 19 113 20 112 21 111 22 110 23 109 24 108 25 107 26 106 27 105 28 104 29 103 30 102 31 101 32 100 33 99 34 98 35 97 36 96 37 38 95 94 39 93 40 92 41 91 42 90 43 89 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 VSS DQY34 DQX34 VSS VDD DQY35 DQX35 VSS VSS AY5 AX5 AY4 AX4 AY3 AX3 AY2 AX2 AY1 AX1 AY0 AX0 VSS VDD AX10 AY10 AX11 AY11 AX12 AY12 AX13 AY13 AX14 AY14 AX15 AY15 AX16 AY16 DQX0 DQY0 VDD V SS DQX1 DQY1 VSS
176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133
VSS DQX15 DQY15 VSS VDD DQX14 DQY14 DQX13 DQY13 VSS VDD DQX12 DQY12 DQX11 DQY11 VSS VDD DQX10 DQY10 DQX9 DQY9 VSS VDD DQY8 DQX8 DQY7 DQX7 VSS VDD DQY6 DQX6 DQY5 DQX5 VSS VDD DQY4 DQX4 DQY3 DQX3 VSS VDD DQY2 DQX2 VSS
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MCM63D736 3
Freescale Semiconductor, Inc.
PIN DESCRIPTIONS
Pin Locations 65, 63, 61, 59, 57, 55, 169, 167, 145, 143, 68, 70, 72, 74, 76, 78, 80 64, 62, 60, 58, 56, 54, 168, 166, 144, 142, 69, 71, 73, 75, 77, 79, 81 82, 86, 90, 94, 96, 100, 102, 106, 108, 113. 115, 119, 121, 125, 127, 131, 135, 139, 170, 174, 2, 6, 8, 12, 14, 18, 20, 25, 27, 31, 33, 37, 39, 43, 47, 51 83, 87, 91, 95, 97, 101, 103, 107, 109, 112, 114, 118, 120, 124, 126, 130, 134, 138, 171, 175, 3, 7, 9, 13, 15, 19, 21, 24, 26, 30, 32, 36, 38, 42, 46, 50 150 151 Symbol AX0 - AX16 AY0 - AY16 DQX0 - DQX35 Type Input Input I/O Description Address Port X: Never allow floating addresses for inputs AX0 - AX16. A pullup resistor is needed. Address Port Y: Never allow floating addresses for inputs AY0 - AY16. A pullup resistor is needed. Data Input/Output Port X.
DQY0 - DQY35
I/O
Data Input/Output Port Y.
E1X E2X E1Y E2Y GX
Input Input Input Input Input
Synchronous Chip Enable Port X: Active low. Synchronous Chip Enable Port X: Active high. Synchronous Chip Enable Port Y: Active low. Synchronous Chip Enable Port Y: Active high. Asynchronous Output Enable Port X Input: Low -- enables output buffers (DQXx pins). High -- DQXx pins are high impedance. Asynchronous Output Enable Port Y Input: Low -- enables output buffers (DQYx pins). High -- DQYx pins are high impedance. Clock: This signal registers the address, data in, and all control signals except G. Pass-Through Port X. Pass-Through Port Y. Synchronous Write Enable Port X. Synchronous Write Enable Port Y. 3.3 V Power Supply.
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157 158 152
153
GY
Input
156 146 147 148 149 4, 10, 16, 22, 28, 34, 40, 49, 67, 84, 92, 98, 104, 110, 116, 122, 128, 137, 155, 172 1, 5, 11, 17, 23, 29, 35, 41, 44, 45, 48, 52, 53, 66, 85, 88, 89, 93, 99, 105, 111, 117, 123, 129, 132, 133, 136, 140, 141, 154, 161, 165, 173, 176 159, 159, 160, 162, 163, 164
K PTX PTY WX WY VDD
Input Input Input Input Input Supply
VSS
Supply
Ground.
NC
--
No Connection: There is no connection to the chip.
MCM63D736 4
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TRUTH TABLE (See Notes 1 through 6)
Operation No. 1 2 3 4 5 6 7 8 Input at tn Clock E1X H X L X L L L X E2X X L H X H H H X E1Y H X X L L L X L E2Y X L X H H H X H WX X X L X X X H X WY X X X L X X X H PTX X X X X L X H H PTY X X X X X L H H Operation Deselected Deselected Write X Port Write Y Port Pass-Through X to Y Pass-Through Y to X Read X Read Y
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NOTES: 1. L = Logic Low; H = Logic High; X = Don't Care. 2. GX/GY must be negated during write and pass-through cycles. 3. Operation numbers 3 - 6 can be used in any combination. 4. Operation numbers 4 and 7, 3 and 8, 7 and 8 can be combined. 5. Operation number 5 can not be combined with operation number 7 or 8 because pass-through takes precedence over a read operation. 6. Operation number 6 can not be combined with operation number 7 or 8 because pass-through takes precedence over a read operation.
tn K
tn + 1
ADDRESS & CONTROL
VALID PIPELINED READ ACCESS
DATA INPUT D DATA OUTPUT Q
VALID PASS-THROUGH VALID
ABSOLUTE MAXIMUM RATINGS (See Notes)
Rating Power Supply Voltage Voltage Relative to VSS for Any Pin Except VDD Output Current Package Power Dissipation Temperature Under Bias Storage Temperature -- Plastic Symbol VDD Vin, Vout Iout PD Tbias Tstg Value -0.5 to 4.6 -0.5 to VDD + 0.5 20 1.6 -10 to 85 -55 to 125 Unit V V mA W C C This is a synchronous device. All synchronous inputs must meet specified setup and hold times with stable logic levels for ALL rising edges of clock (K) while the device is selected. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to these high-impedance circuits.
NOTES: 1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to RECOMMENDED OPERATING CONDITIONS. Exposure to higher than recommended voltages for extended periods of time could affect device reliability. 2. Power dissipation capability is dependent upon package characteristics and use environment. See Package Thermal Characteristics.
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MCM63D736 5
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PACKAGE THERMAL CHARACTERISTICS (See Note 1)
Rating Junction to Ambient (@ 200 lfm) Junction to Board (Bottom) Junction to Case (Top) Single-Layer Board Four-Layer Board Symbol RJA RJB RJC TQFP 35 30 23 9 Unit C/W C/W C/W Notes 2 3 4
NOTES: 1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance between the die and the printed circuit board. 4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC-883 Method 1012.1).
DC OPERATING CONDITIONS AND CHARACTERISTICS
(VDD = 3.3 V 5%, TA = 0 to 70C, Unless Otherwise Noted)
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RECOMMENDED OPERATING CONDITIONS AND SUPPLY CURRENTS
Parameter Supply Voltage (Operating Voltage Range) Input High Voltage Input Low Voltage Input Leakage Current (All Inputs, Vin = 0 to VDD) Output Leakage Current (E = VIH, Vout = 0 to VDD) AC Supply Current (Iout = 0 mA) (VDD = Max, f = fmax) Symbol VDD VIH VIL Ilkg(I) Ilkg(O) IDDA-133 IDDA-100 IDDA-83 ISB1 Min 3.135 2.0 -0.5* -- -- -- Max 3.465 VDD + 0.5** 0.8 1.0 1.0 400 350 325 100 Unit V V V A A mA
CMOS Standby Supply Current (Deselected, Clock (K) Cycle Time tKHKH, All Inputs Toggling at CMOS Levels Vin VSS + 0.2 V or VDD - 0.2 V) Output Low Voltage (IOL = 8.0 mA) Output High Voltage (IOH = -4.0 mA) * VIL -1.5 V for t tKHKH/2. ** VIH VDD + 1.0 V (not to exceed 4.6 V) for t tKHKH/2.
--
mA
VOL VOH
-- 2.4
0.4 VDD
V V
CAPACITANCE (f = 1.0 MHz, TA = 0 to 70C, Periodically Sampled Rather Than 100% Tested)
Parameter Address and Data Input Capacitance Control Pin Input Capacitance Output Capacitance Symbol Cin Cin Cout Max 6 6 8 Unit pF pF pF
MCM63D736 6
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AC OPERATING CONDITIONS AND CHARACTERISTICS
(VDD = 3.3 V 5%, TA = 0 to 70C, Unless Otherwise Noted)
Input Timing Measurement Reference Level . . . . . . . . . . . . . . . 1.5 V Input Pulse Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 3.0 V Input Rise/Fall Time . . . . . . . . . . . . . . . . . . . . . . 1 V/ns (20% to 80%) Output Timing Reference Level . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 V Output Load . . . . . . . . . . . . . . . . . . Figure 1 Unless Otherwise Noted
READ/WRITE CYCLE TIMING (See Notes 1, 2, and 3)
MCM63D736-133 Parameter Cycle Time Clock Access Time Clock Low Pulse Width Clock High Pulse Width Clock High to Data Output Active Symbol tKHKH tKHQV tKLKH tKHKL tKHQX1 tKHQX2 tKHQZ tGLQV tGLQX tGHQZ tAVKH tAVKH tWVKH tPTVKH tEVKH tDVKH tKHAX tKHAX tKHWX tKHPTX tKHEX tKHDX Min 7.5 -- 3 3 0 1 -- -- 0 -- 1.5 Max -- 4 -- -- -- -- 3 4 -- 3 -- MCM63D736-100 Min 10 -- 4 4 0 1 -- -- 0 -- 1.5 Max -- 5 -- -- -- -- 3 5 -- 3 -- MCM63D736-83 Min 12 -- 4 4 0 1 -- -- 0 -- 2.5 Max -- 6 -- -- -- -- 4 6 -- 5 -- Unit ns ns ns ns ns ns ns ns ns ns ns 2 3 2 Notes 1
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Clock High to Data Output Invalid Clock High to Data Output High-Z Output Enable Low to Data Output Valid Output Enable Low to Data Output Low-Z Output Enable High to Data Output High-Z Setup Times: AWR0 - AWR16 ARD0 - ARD16 W PT E1X, E2X, E1Y, E2Y D0 - D35 AWR0 - AWR16 ARD0 - ARD16 W PT E1X, E2X, E1Y, E2Y D0 - D35
Hold Times:
0.5
--
0.5
--
0.5
--
ns
3
NOTES: 1. All read and write cycles are referenced from K. 2. This parameter is sampled and not 100% tested. 3. This is a synchronous device. All synchronous inputs must meet the specified setup and hold times with stable logic levels for ALL rising edges of clock (K) while the device is selected.
OUTPUT Z0 = 50
RL = 50
VL = 1.5 V
Figure 1. AC Test Load
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MCM63D736 7
Freescale Semiconductor, Inc.
READ CYCLE TIMING FROM BOTH PORTS (WX, WY, PTX, PTY HIGH)
tKHKH K tAVKH AX 1 2 3 tKHAX 4 5 6 7 8 9 tKLKH tKHKL
PORT X
GX tKHQV tKHQX1 Q(1) tEVKH Ex tKHEX AY 12 13 14 15 16 6 7 19 20 Q(2) Q(3) tGHQZ Q(5) Q(6) Q(7) tGLQX tGLQV
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DQX
PORT Y
GY tKHQZ DQY Q(12) Q(13) Q(14) tKHQV Q(16) Q(6) Q(7)
NOTE: Ex Low = E1x Low and E2x High. Ex High = E1x High or E2x Low.
MCM63D736 8
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WRITE CYCLE TIMING TO BOTH PORTS (PTX, PTY HIGH)
tKHKH K tKLKH tKHKL
AX
1 tWVKH
2
3 tKHWX
4
5
6
7
8
9
WX PORT X
GX
Freescale Semiconductor, Inc...
tDVKH D(2) D(3) D(4)
tKHDX D(8) D(9)
DQX
Ex
AY
12
13
14
15
5
6
18
19
20
WY PORT Y GY
DQY
D(14)
D(15)
D(5)
D(6)
D(18)
D(19)
PORT Y TAKES PRECEDENCE OVER PORT X WHEN AX = AY AND WRITING BOTH PORTS. NOTE: Ex Low = E1x Low and E2x High. Ex High = E1x High or E2x Low.
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MCM63D736 9
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WRITE TO PORT X AND PASS-THROUGH TO PORT Y (SEE NOTES)
tKHKH K tKLKH tKHKL
AX
1
2
3
4
5
6
7
8
9
WX
PORT X
GX tKHPTX tPTVKH
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PTX tDVKH DQX D(2) D(3) D(X) tKHDX D(Y) D(6)
Ex
AY
12
13
14
15
16
17
18
19
20
WY
PORT Y
GY
PTY tKHQV tKHQX2 DQY D(3) D(X) D(Y) tKHQZ D(17)
NOTES: Ex Low = E1x Low and E2x High. Ex High = E1x High or E2x Low. The timing diagram is valid for the opposite case as well, i.e., writing to Port Y and passing through to Port X.
MCM63D736 10
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COMBINATION READ/WRITE WITH SAME ADDRESS ON EACH PORT
tKHKH K TRY TO WRITE AX 1 TRY TO WRITE 2 READ 1 READ READ READ 2 READ READ 3 tKLKH tKHKL
WX PORT X GX
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DQX
D(ABC)
D(DEF)
Q(PQR)
Q(XYZ)
Q(JKL)
WRITE AY 1
WRITE 2
READ 1
READ
READ
WRITE 2
READ
READ 3
WY PORT Y GY
DQY
D(PQR)
D(XYZ)
Q(PQR)
D(JKL)
Q(JKL)
PORT Y TAKES PRECEDENCE OVER PORT X WHEN AX = AY AND WRITING BOTH PORTS. NOTES: PTX = PTY = high. D(Value) = Value is the input to the data port. Q(Value) = Value is the output from the data port.
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MCM63D736 11
Freescale Semiconductor, Inc.
ORDERING INFORMATION
(Order by Full Part Number) MCM 63D736 XX XXX X
Freescale Memory Prefix Part Number Shipping Method (Blank = Trays) Speed (133 = 133 MHz, 100 = 100 MHz, 83 = 83 MHz) Package (TQ = TQFP) Full Part Numbers -- MCM63D736TQ133 MCM63D736TQ100 MCM63D736TQ83
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MCM63D736 12
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PACKAGE DIMENSIONS
TQFP PACKAGE 176-LEAD CASE 1101-01 G
4X PIN 1 IDENT 1
0.20 H L-M N C L
176
4X 44 TIPS
0.20 T L-M N C L
P
133 132
AB AB -X- X=L, M, N VIEW Y
3X
VIEW Y -M-
PLATING
F
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-L- B1
V1
U
44 45 88
89
0.08
ROTATED 90_ CLOCKWISE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -L-, -M-, AND -N- TO BE DETERMINED AT DATUM PLANE -H-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -T-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INLCUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.35 (0.014) MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD 0.07 (0.003). DIM A A1 B B1 C C1 C2 D E F G J K P R1 S S1 U V V1 W Z q q1 q2 MILLIMETERS MIN MAX 24.00 BSC 12.00 BSC 24.00 BSC 12.00 BSC --- 1.60 0.05 --- 1.35 1.45 0.17 0.23 0.45 0.75 0.17 0.27 0.50 BSC 0.09 0.20 0.50 REF 0.25 BSC 0.10 0.20 26.00 BSC 13.00 BSC 0.09 0.16 26.00 BSC 13.00 BSC 0.20 REF 1,00 REF 0_ 7_ 0_ --- 12 _REF
SECTION AB-AB
-N- A1 S1 A S
VIEW AA C -H- -T-
SEATING PLANE 4X
q2
0.08 T
0.05 W
S
q1 C2
2X R R1
0.25
GAGE PLANE
C1
K E Z VIEW AA
q
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EEEE CCC EEEE CCC EEEE CCC
D
M
C L
B
BASE METAL
V
J
T L-M
S
N
S
MCM63D736 13
Freescale Semiconductor, Inc.
NOTES
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MCM63D736 14
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NOTES
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MCM63D736 15
Freescale Semiconductor, Inc.
How to Reach Us:
Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com
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Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of Asia/Pacific: any product or circuit, and specifically disclaims any and all liability, including without Freescale Semiconductor Hong Kong Ltd. limitation consequential or incidental damages. "Typical" parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do Technical Information Center vary in different applications and actual performance may vary over time. All operating 2 Dai King Street parameters, including "Typicals" must be validated for each customer application by Tai Po Industrial Estate customer's technical experts. Freescale Semiconductor does not convey any license Tai Po, N.T., Hong Kong under its patent rights nor the rights of others. Freescale Semiconductor products are +800 2666 8080 not designed, intended, or authorized for use as components in systems intended for support.asia@freescale.com surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer For Literature Requests Only: Freescale Semiconductor Literature Distribution Center purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor P.O. Box 5405 and its officers, employees, subsidiaries, affiliates, and distributors harmless against all Denver, Colorado 80217 claims, costs, damages, and expenses, and reasonable attorney fees arising out of, 1-800-441-2447 or 303-675-2140 directly or indirectly, any claim of personal injury or death associated with such Fax: 303-675-2150 unintended or unauthorized use, even if such claim alleges that Freescale LDCForFreescaleSemiconductor@hibbertgroup.com Semiconductor was negligent regarding the design or manufacture of the part.


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